Local Interface Strength Evaluation for LSI Interconnect with Micron Resolution

N. Shishido; C. Chen; H. Sato; S. Kamiya; M. Nishida; M. Omiya; T. Nokuo; T. Nagasawa; T. Suzuki; T. Nakamura

doi:https://doi.org/10.7567/SSDM.2011.C-8-5

[C-8-5] Local Interface Strength Evaluation for LSI Interconnect with Micron Resolution

N. Shishido^1,5, C. Chen¹, H. Sato^1,5, S. Kamiya^1,5, M. Nishida^1,5, M. Omiya^2,5, T. Nokuo^3,5, T. Nagasawa^3,5, T. Suzuki⁴, T. Nakamura⁴ (1.Nagoya Inst. of Tech., 2.Keio Univ., 3.JEOL Ltd., 4.Fujitsu Labs Ltd., 5.CREST-JST , Japan)

https://doi.org/10.7567/SSDM.2011.C-8-5

2011 International Conference on Solid State Devices and Materials

[C-8-5] Local Interface Strength Evaluation for LSI Interconnect with Micron Resolution