[C-9-3] Oxidation Resistance of Ti Oxide Self-Formed Barrier in Cu Interconnects

K. Ito¹、K. Kohama¹、K. Hamasaka¹、Y. Shirai¹、M. Murakami² (1.Kyoto Univ.、2.The Ritsumeikan Trust , Japan)

https://doi.org/10.7567/SSDM.2011.C-9-3