[P-2-10] Thermal Cycling Reliability of ChipArray^® Thin Core Ball Grid Array assemblies with Fast Cure and Reworkable Capillary Flow Underfill

H. Shi¹、T. Ueda¹ (1.Waseda Univ. , Japan)

https://doi.org/10.7567/SSDM.2011.P-2-10