Evolution of Wafer Shape and Localized Stress of Silicon Surrounded by Through Silicon Via Patterns along Various Process Integration Steps

2011 International Conference on Solid State Devices and Materials

Sep 27, 2011 - Sep 30, 2011
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

C. H. Lee¹, S. H. Jie¹, S. H. Son¹, J. T. Kim¹, H. W. Yoo¹, I. K. Han¹, W. S. Yoo² (1.Hynix Semiconductor Inc. , Korea, 2.WaferMasters, Inc. , USA)