[P-2-7] Improvement of the BCB Adhesion on Cr/Au Metal Layer for RF Packaging Module

N. Jeon¹, Y. H. Oh¹, Y. Ryoo¹, K. S. Seo¹ (1.Seoul National Univ. , Korea)

https://doi.org/10.7567/SSDM.2011.P-2-7