[P-2-8] Testkey Design of Through Silicon Vias (TSVs) for Accurate De-embedding and RF Model Parameters Extraction

J. Y. Wang¹、T. K. Huang¹、Y. C. Wu¹、S. S. H. Hsu¹、Z. H. Lin²、C. S. Lin²、S. S. Sheu²、T. K. Ku²、C. H. Lin² (1.National Tsing Hua Univ.、2.ITRI , Taiwan)

https://doi.org/10.7567/SSDM.2011.P-2-8