Testkey Design of Through Silicon Vias (TSVs) for Accurate De-embedding and RF Model Parameters Extraction

J. Y. Wang; T. K. Huang; Y. C. Wu; S. S. H. Hsu; Z. H. Lin; C. S. Lin; S. S. Sheu; T. K. Ku; C. H. Lin

doi:https://doi.org/10.7567/SSDM.2011.P-2-8

2011 International Conference on Solid State Devices and Materials

Sep 27, 2011 - Sep 30, 2011
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

[P-2-8] Testkey Design of Through Silicon Vias (TSVs) for Accurate De-embedding and RF Model Parameters Extraction

J. Y. Wang¹, T. K. Huang¹, Y. C. Wu¹, S. S. H. Hsu¹, Z. H. Lin², C. S. Lin², S. S. Sheu², T. K. Ku², C. H. Lin² (1.National Tsing Hua Univ., 2.ITRI , Taiwan)

https://doi.org/10.7567/SSDM.2011.P-2-8

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