Evaluation of the WO<sub>x</sub> Film Properties for ReRAM Application

Y. Y. Chen; W. C. Chien; M. H. Lee; Y. C. Chen; A. T. H. Chuang; T. J. Hong; S. J. Lin; T. B. Wu; C. Y. Lu

doi:https://doi.org/10.7567/SSDM.2011.P-4-7

2011 International Conference on Solid State Devices and Materials

2011年9月27日〜 2011年9月30日
Aichi Industry & Labor Center (WINC AICHI), Nagoya, Japan

[P-4-7] Evaluation of the WO_x Film Properties for ReRAM Application

Y. Y. Chen^1,2、W. C. Chien²、M. H. Lee²、Y. C. Chen²、A. T. H. Chuang²、T. J. Hong¹、S. J. Lin¹、T. B. Wu¹、C. Y. Lu² (1.National Tsing Hua Univ.、2.Macronix Int'l Corp., Ltd. , Taiwan)

https://doi.org/10.7567/SSDM.2011.P-4-7

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2011 International Conference on Solid State Devices and Materials

[P-4-7] Evaluation of the WOx Film Properties for ReRAM Application

[P-4-7] Evaluation of the WO_x Film Properties for ReRAM Application