Reliability of MIM Capacitors Under Pads for Au or Cu Wire Bonding

J. P. Gambino; C. Griffin; K. Watson; J. Malinowski; A. Cote; B. Guthrie; A. Vize; T. Aoki

doi:https://doi.org/10.7567/SSDM.2012.H-6-4

2012 International Conference on Solid State Devices and Materials

2012年9月25日〜 2012年9月27日
Kyoto International Conference Center, Kyoto, Japan

[H-6-4] Reliability of MIM Capacitors Under Pads for Au or Cu Wire Bonding

J. P. Gambino¹、C. Griffin¹、K. Watson¹、J. Malinowski¹、A. Cote¹、B. Guthrie¹、A. Vize¹、T. Aoki² (1.IBM Microelectronics , USA、2.IBM Yamato Laboratory , Japan)

https://doi.org/10.7567/SSDM.2012.H-6-4

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