Reliability of MIM Capacitors Under Pads for Au or Cu Wire Bonding

J. P. Gambino; C. Griffin; K. Watson; J. Malinowski; A. Cote; B. Guthrie; A. Vize; T. Aoki

doi:https://doi.org/10.7567/SSDM.2012.H-6-4

2012 International Conference on Solid State Devices and Materials

Sep 25, 2012 - Sep 27, 2012
Kyoto International Conference Center, Kyoto, Japan

[H-6-4] Reliability of MIM Capacitors Under Pads for Au or Cu Wire Bonding

J. P. Gambino¹, C. Griffin¹, K. Watson¹, J. Malinowski¹, A. Cote¹, B. Guthrie¹, A. Vize¹, T. Aoki² (1.IBM Microelectronics , USA, 2.IBM Yamato Laboratory , Japan)

https://doi.org/10.7567/SSDM.2012.H-6-4

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