The Japan Society of Applied Physics

[H-6-6L] Development of Cu/insulation layer interface crack extension simulation with single crystal plasticity

K. Koiwa1,2、M. Omiya2,3、N. Shishido1,2、S. Kamiya1,2、H. Sato1,2、M. Nishida1,2、T. Suzuki2,5、T. Nakamura4、T. Nokuo2,5 (1.Nagoya Inst. of Tech.、2.Japan Sci. and Tech. Agency、3.Keio Univ.、4.Fujitsu labs. Ltd.、5.JEOL Ltd. , Japan)

https://doi.org/10.7567/SSDM.2012.H-6-6L