[K-4-2] Room-Temperature Cu Microjoining Using Ultrasonic Bonding of Cone Shaped Bump

L. J. Qiu¹、T. Asano¹、K. Noda²、S. Nakai² (1.Kyushu Univ.、2.Adwelds Co.,Ltd , Japan)

https://doi.org/10.7567/SSDM.2012.K-4-2