[PS-2-2] Improvement of Crystallographic Quality of Electroplated Copper Thin-Film Interconnections for 3D TSVs

N. Murata¹、K. Suzuki¹、R. Furuya¹、O. Asai¹、H. Miura¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.PS-2-2