[PS-2-2] Improvement of Crystallographic Quality of Electroplated Copper Thin-Film Interconnections for 3D TSVs

N. Murata¹, K. Suzuki¹, R. Furuya¹, O. Asai¹, H. Miura¹ (1.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.PS-2-2