[PS-2-3] 10-μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications

T. Fukushima¹、J. Bea¹、M. Murugesan¹、K. Lee¹、T. Tanaka²、M. Koyanagi¹ (1.Tohoku Univ.、2.Tohoku Univ. , Japan)

https://doi.org/10.7567/SSDM.2012.PS-2-3