[PS-2-3] 10-μm-Pitch In-Au Microbump Interconnection by Chip Self-Assembly with Excimer Lamp Irradiation for 3D LSI Applications
T. Fukushima1, J. Bea1, M. Murugesan1, K. Lee1, T. Tanaka2, M. Koyanagi1
(1.Tohoku Univ., 2.Tohoku Univ. , Japan)
https://doi.org/10.7567/SSDM.2012.PS-2-3
