[G-7-3] Micro-Texture Dependence of Mechanical Properties of Fine Metallic Bumps Used for Three-Dimensional Electronic Packaging

K. Suzuki¹, R. Furuya¹, F. Endo¹, H. Miura¹ (1.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2013.G-7-3