[G-8-1] Low-Temperature and High-Step-Coverage Polyimide TSV Liner Formation by Vapor Deposition Polymerization

T. Fukushima¹、M. Murugesan¹、J. Bea¹、K.W. Lee¹、M. Koyanagi¹ (1.Tohoku Univ. (Japan))

https://doi.org/10.7567/SSDM.2013.G-8-1