[G-8-2] Electromigration effect on mechanical shock behavior of Sn-Ag-Bi-In + Co solder joints for surface-mounted chip components

Y. Kim¹、S. Nagao¹、T. Sugahara¹、K. Suganuma¹ (1.Osaka Univ. (Japan))

https://doi.org/10.7567/SSDM.2013.G-8-2