[G-8-3] Evaluation of Power Dissipation and Delay for New TSV Design Based on Cu/Sn to BCB Hybrid Bonding

Y.J. Chang¹、C.T. Ko^1,2、Z.C. Hsiao²、H.C. Fu²、T.H. Yu¹、W.C. Lo²、K.N. Chen¹ (1.Department of Electronics Engineering, National Chiao Tung Univ.、2.Electronics and Optoelectronics Research Laboratories, ITRI (Taiwan))

https://doi.org/10.7567/SSDM.2013.G-8-3