[G-8-3] Evaluation of Power Dissipation and Delay for New TSV Design Based on Cu/Sn to BCB Hybrid Bonding

Y.J. Chang¹, C.T. Ko^1,2, Z.C. Hsiao², H.C. Fu², T.H. Yu¹, W.C. Lo², K.N. Chen¹ (1.Department of Electronics Engineering, National Chiao Tung Univ., 2.Electronics and Optoelectronics Research Laboratories, ITRI (Taiwan))

https://doi.org/10.7567/SSDM.2013.G-8-3