[K-4-4] GaAs/AlAs Coupled Multilayer Cavity by Wafer-Bonding for Two-Color Emission Devices

C. Harayama¹, S. Katoh¹, Y. Nakagawa^1,2, K. Morita¹, T. Kitada¹, T. Isu¹ (1.Univ. of Tokushima, 2.NICHIA Corp. (Japan))

https://doi.org/10.7567/SSDM.2013.K-4-4