[A-1-3] Interface Engineering in Homogeneous Barrier Modulation RRAM for 3D Vertical Memory Applications

W.L. Lai¹, C.T. Chou¹, C.W. Hsu¹, J.C. Liu¹, B. Hudec¹, C.H. Ho², W.Y. Jang², C.H. Lin², T.H. Hou¹ (1.NCTU, 2.Winbond Electronics Corp. (Taiwan))

https://doi.org/10.7567/SSDM.2014.A-1-3