[A-6-4] Study about the Process Damage Mechanism of the Patterned Interface Perpendicular Magnetic Tunnel Juncotions (MTJs) by Hydrogen Ion Treatments

J.H. Jeong^1,3, T. Endoh^1,2 (1.Tohoku Univ., 2.Center for Innovative Integrated Electronic Systems (CIES), 3.SAMSUNG Electronics Co., Ltd. (Japan))

https://doi.org/10.7567/SSDM.2014.A-6-4