[B-6-3] A Method Enables Height-Control of Bonding Chip for Edge-Emitting Laser Stacking

M. Aoyagi¹, T.T. Bui¹, L. Ma¹, T. Amano¹, K. Kikuchi¹, M. Mori¹ (1.AIST (Japan))

https://doi.org/10.7567/SSDM.2014.B-6-3