[B-6-3] A Method Enables Height-Control of Bonding Chip for Edge-Emitting Laser Stacking

M. Aoyagi¹、T.T. Bui¹、L. Ma¹、T. Amano¹、K. Kikuchi¹、M. Mori¹ (1.AIST (Japan))

https://doi.org/10.7567/SSDM.2014.B-6-3