Nickel Compound and Alloy Contacts to Nanoscale Si, Ge, and InGaAs Channels

R. Chen; B.-M. Nguyen; W. Tang; S.A. Dayeh

doi:https://doi.org/10.7567/SSDM.2014.F-4-1

2014 International Conference on Solid State Devices and Materials

Sep 8, 2014 - Sep 11, 2014
Tsukuba International Congress Center (EPOCHAL TSUKUBA), Ibaraki, Japan

[F-4-1] Nickel Compound and Alloy Contacts to Nanoscale Si, Ge, and InGaAs Channels

R. Chen¹, B.-M. Nguyen^1,2, W. Tang^2,3, S.A. Dayeh¹ (1.Univ. of California San Diego, 2.Los Alamos National Laboratory, 3.Univ. of California Los Angeles (USA))

https://doi.org/10.7567/SSDM.2014.F-4-1

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