Mechanical Properties of Cu-Ni-Si alloy Evaluated by Micro-Tensile Test for Application in MEMS

S. Yanagida

doi:https://doi.org/10.7567/SSDM.2015.E-4-1

2015 International Conference on Solid State Devices and Materials

2015年9月27日〜 2015年9月30日
Sapporo Convention Center, Sapporo, Japan

15:40 〜 16:00

[E-4-1] Mechanical Properties of Cu-Ni-Si alloy Evaluated by Micro-Tensile Test for Application in MEMS

^○S. Yanagida^1,2, A. Araki¹, T. F. M. Chang^1,2, C. Y. Chen^1,2, T. Nagoshi³, E. Kobayashi¹, H. Hosoda¹, T. Sato¹, M. Sone^1,2 (1.Tokyo Tech, 2.JST-CREST, 3.AIST(Japan))

https://doi.org/10.7567/SSDM.2015.E-4-1

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