The Japan Society of Applied Physics

09:00 〜 09:30

[E-6-1] (Invited) 3D Interconnection of Single Micron Pitch by Hybrid Bonding Technology

M. Nimura1, M. Ohyama1, S. Shoji1, M. Tamura2, T. Enomoto2, A. Shigetou3, J. Mizuno1 (1.Waseda Univ., 2.Nissan Chemical Indus., 3.NIMS(Japan))

https://doi.org/10.7567/SSDM.2015.E-6-1