9:00 AM - 9:30 AM

[E-6-1] (Invited) 3D Interconnection of Single Micron Pitch by Hybrid Bonding Technology

M. Nimura¹, M. Ohyama¹, S. Shoji¹, M. Tamura², T. Enomoto², A. Shigetou³, ^○J. Mizuno¹ (1.Waseda Univ., 2.Nissan Chemical Indus., 3.NIMS(Japan))

https://doi.org/10.7567/SSDM.2015.E-6-1