Investigation of Low Temperature Cu Pillar Thermosonic Bonding for 3D Integration Applications

S. L. Lu

doi:https://doi.org/10.7567/SSDM.2015.E-6-3

2015 International Conference on Solid State Devices and Materials

2015年9月27日〜 2015年9月30日
Sapporo Convention Center, Sapporo, Japan

09:50 〜 10:10

[E-6-3] Investigation of Low Temperature Cu Pillar Thermosonic Bonding for 3D Integration Applications

^○S. L. Lu¹, Y. P. Huang¹, Y. S. Huang¹, Y. H. Tseng², M. F. Shu², K. N. Chen¹ (1.National Chiao Tung Univ., 2.Advanced Semiconductor Engineering Group(Taiwan))

https://doi.org/10.7567/SSDM.2015.E-6-3

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