The Japan Society of Applied Physics

16:30 〜 16:50

[K-4-3] W and Copper Interconnection Stability for 3D VLSI CoolCube Integration

C. Fenouillet Beranger1, S. Kerdiles1, F. Deprat1,3, P. Batude1, M. P. Samson2,1, B. Previtali1, N. Rambal1,2, V. Lapras1,2, L. Emery2, C. Euvrard Colnat1, A. Seignard1,2, P. Besson2,1, KachtouliR. 1, A. Roman2,1, C. Ribiere1,V. Lu2,1, L. Brunet1, E. Gourvest2, G. Druais2, Y. Loquet2, L. Arnaud1, Y. Le Friec2, O. Pollet1, V. Benevent1, F. Aussenac1, H. Denis1, V. Jousseaume1, S. Maitrejean1, M. Vinet1 (1.CEA-LETI, 2.STMicroelectronics, 3.IMEP(France))

https://doi.org/10.7567/SSDM.2015.K-4-3