Mechanical Properties of Electrodeposited Gold for MEMS Device

M. Yoshiba

doi:https://doi.org/10.7567/SSDM.2015.PS-2-1

2015 International Conference on Solid State Devices and Materials

Sep 27, 2015 - Sep 30, 2015
Sapporo Convention Center, Sapporo, Japan

[PS-2-1] Mechanical Properties of Electrodeposited Gold for MEMS Device

^○M. Yoshiba^1,2, C. Y. Chen^1,2, T. F. M. Chang^1,2, D. Yamane^1,2, K. Machida^1,2,3, K. Masu^1,2, M. Sone^1,2 (1.Tokyo Tech, 2.JST-CREST, 3.NTT Adv. Tech. Corp.(Japan))

https://doi.org/10.7567/SSDM.2015.PS-2-1

▲