The Japan Society of Applied Physics

[PS-2-10] Improving Step Coverage of PVD Barrier/Seed through Bias Power Alternation for High Aspect Ratio TSVs

S. Yang1, W. Cheng1, H. Wu1, C. Song1,2, W. Zhang1,2 (1.National Center for Advanced Packaging Co., LTD., 2.Inst. of Microelectronics, Chinease Academy of Sci.(China))

https://doi.org/10.7567/SSDM.2015.PS-2-10