Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications

T. Fukushima

doi:https://doi.org/10.7567/SSDM.2015.PS-2-12

[PS-2-12] Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications

^○T. Fukushima¹, K. Taniguchi², S. Watariguchi², M. Murugesan¹, C. Nagai¹, A. Nakamura¹, H. Hiroyuki¹, J. Bea¹, T. Tanaka¹, M. Koyanagi¹, K. Lee¹ (1.Tohoku Univ., 2.Meltex Inc.(Japan))

https://doi.org/10.7567/SSDM.2015.PS-2-12

2015 International Conference on Solid State Devices and Materials

[PS-2-12] Electroless Nickel Barrier/Seed Layer Deposition on Dielectric Liners for Advanced Cu-TSV Applications