[PS-2-17] Measurement of the Strength at Grain Boundaries in Electroplated Copper Thin-Film Interconnections

^○T. Nakanishi¹, T. Kato¹, Y. Ichikawa¹, K. Suzuki¹, H. Miura¹ (1.Tohoku Univ.(Japan))

https://doi.org/10.7567/SSDM.2015.PS-2-17