[PS-2-4] Micro-Texture Dependence of the Strength of Electroplated Copper Fine Bumps Used for 3-Dimensonal Integration

^○M. Gotoh¹, K. Suzuki¹, H. Miura¹ (1.Tohoku Univ.(Japan))

https://doi.org/10.7567/SSDM.2015.PS-2-4