[PS-2-6] Combined Surface-Activated Bonding Technique for Low-Temperature Hydrophilic Wafer Bonding with Interfacial Water Management

^○R. He¹, M. Fujino¹, A. Yamauchi², T. Suga¹ (1.Univ. of Tokyo, 2.Bondtech Co., Ltd.(Japan))

https://doi.org/10.7567/SSDM.2015.PS-2-6