Transient Liquid-Phase Sintering using Tin and Silver Powder Mixture for Die Bonding

M. Fujino

doi:https://doi.org/10.7567/SSDM.2015.PS-2-7

2015 International Conference on Solid State Devices and Materials

Sep 27, 2015 - Sep 30, 2015
Sapporo Convention Center, Sapporo, Japan

[PS-2-7] Transient Liquid-Phase Sintering using Tin and Silver Powder Mixture for Die Bonding

^○M. Fujino¹, H. Narusawa¹, Y. Kuramochi¹, E. Higurashi¹, T. Suga¹, T. Shiratori², M. Mizukoshi³ (1.Univ. of Tokyo, 2.ALPHA DESIGN CO., LTD., 3.SYNDEO(Japan))

https://doi.org/10.7567/SSDM.2015.PS-2-7

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