The Japan Society of Applied Physics

[PS-2-7] Transient Liquid-Phase Sintering using Tin and Silver Powder Mixture for Die Bonding

M. Fujino1, H. Narusawa1, Y. Kuramochi1, E. Higurashi1, T. Suga1, T. Shiratori2, M. Mizukoshi3 (1.Univ. of Tokyo, 2.ALPHA DESIGN CO., LTD., 3.SYNDEO(Japan))

https://doi.org/10.7567/SSDM.2015.PS-2-7