[PS-2-8] A Novel Hybrid Strategy of via-first Bare TSVs for Enhanced Signal Integrity in 3-D Integrated Systems

^○R. Fang¹, X. Sun¹, M. Miao², Y. Jin¹ (1.Peking Univ., 2.Beijing Information Sci.&Tech. Univ.(China))

https://doi.org/10.7567/SSDM.2015.PS-2-8