Measurement of the Strength at Grain Boundaries in Electroplated Copper Thin-Film Interconnections

2015 International Conference on Solid State Devices and Materials

Sep 27, 2015 - Sep 30, 2015
Sapporo Convention Center, Sapporo, Japan

^○T. Nakanishi¹, T. Kato¹, Y. Ichikawa¹, K. Suzuki¹, H. Miura¹ (1.Tohoku Univ.(Japan))