A Novel Hybrid Strategy of via-first Bare TSVs for Enhanced Signal Integrity in 3-D Integrated Systems

2015 International Conference on Solid State Devices and Materials

Sep 27, 2015 - Sep 30, 2015
Sapporo Convention Center, Sapporo, Japan

^○R. Fang¹, X. Sun¹, M. Miao², Y. Jin¹ (1.Peking Univ., 2.Beijing Information Sci.&Tech. Univ.(China))