Fabrication and Packaging of an Integrated Pressure and Temperature Sensor with High Immunity Against External Disturbance Under Flexible Endoscopic Operation

Y. Maeda

doi:https://doi.org/10.7567/SSDM.2016.H-4-01

1:30 PM - 1:45 PM

[H-4-01] Fabrication and Packaging of an Integrated Pressure and Temperature Sensor with High Immunity Against External Disturbance Under Flexible Endoscopic Operation

^○Y. Maeda^1,3, K. Maeda¹, H. Kobara^2,3, H. Mori^2,3, H. Takao^1,3 (1.Faculty of Eng., Kagawa Univ.(Japan), 2.Faculty of Med., Kagawa Univ.(Japan), 3.JST-CREST(Japan))

https://doi.org/10.7567/SSDM.2016.H-4-01

2016 International Conference on Solid State Devices and Materials

[H-4-01] Fabrication and Packaging of an Integrated Pressure and Temperature Sensor with High Immunity Against External Disturbance Under Flexible Endoscopic Operation