16:10 〜 16:30

[K-2-02] Impact of Dry Process Damage on Chemical Mechanical Planarization with Cu/low-k Structure

^○M. Kodera¹, H. Yano¹, N. Miyashita¹ (1.Toshiba Corp.(Japan))

https://doi.org/10.7567/SSDM.2016.K-2-02