16:50 〜 17:05

[K-2-04(Late News)] Cost-effective Means to Improve Barrier Performance of Ti in Cu-TSVs for 3D Integration

^○M. Mariappan¹, J. Bea¹, T. Fukushima¹, M. Koyanagi¹ (1.Tohoku Univ.(Japan))

https://doi.org/10.7567/SSDM.2016.K-2-04L