10:40 〜 11:00

[M-5-04] Dynamics of Ultrasonic Cu Ball Bonding Measured in-situ by Using Piezoresistive Linear Array Sensors

^○K. Iwanabe¹, K. Nakadozono¹, T. Asano¹ (1.Kyushu Univ.(Japan))

https://doi.org/10.7567/SSDM.2016.M-5-04