11:15 〜 11:45

[O-6-01(Invited)] Ultra-thin Dielectric Insertions for Contact Resistivity Lowering in Advanced CMOS: Promise and Challenges

^○L. Hutin¹, J. Borrel^1,2, Y. Morand², F. Nemouchi¹, M. Vinet¹ (1.CEA-LETI(France), 2.STMicroelectronics(France))

https://doi.org/10.7567/SSDM.2016.O-6-01