15:00 〜 17:00

[PS-1-07] Integration of Low Temperature 480℃ SiOCN as Offset Spacer in view of 3D Sequential Integration

^○C. -M. V. Lu^1,2, C. Fenouillet-Béranger¹, C. Bout¹, A. Roule¹, V. Beugin¹, J. Fort³, C. Arvet², N. Posseme¹, V. Loup¹, P. Besson², M. -P. Samson², B. Previtali¹, C. Tabone¹, A. Michallet², N. Rochat¹, D. Benoit², F. Pierre¹, L. Brunet¹, P. Batude¹, T. Skotnicki², M. Vinet¹ (1.CEA-LETI(France), 2.STMicroelectronics(France), 3.Applied Materials France(France))

https://doi.org/10.7567/SSDM.2016.PS-1-07