Physical Surface Treatments for Improving Direct Copper Bonding

P. H. Chiang

doi:https://doi.org/10.7567/SSDM.2016.PS-2-5-09

2016 International Conference on Solid State Devices and Materials

2016年9月26日〜 2016年9月29日
Tsukuba International Congress Center, Tsukuba, Japan

15:00 〜 17:00

[PS-2-09] Physical Surface Treatments for Improving Direct Copper Bonding

P. H. Chiang¹,^○S. Y. Liang¹, J. M. Song¹, S. K. Huang², Y. T. Chiu², C. P. Hung² (1.National Chung Hsing Univ.(Taiwan), 2.Advanced Semiconductor Engineering Group(Taiwan))

https://doi.org/10.7567/SSDM.2016.PS-2-5-09

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